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Ortho-Cresol Formaldehyde Epoxy Resin

Ortho-Cresol Formaldehyde Epoxy Resin

Features of Ortho-Cresol Formaldehyde Epoxy Resin

Product Information

  • Product Name: Ortho-Cresol Formaldehyde Epoxy Resin
  • Chemical Formula: N/A
  • CAS No.: N/A
  • Dangerous Grade: Not regulated as dangerous chemical

Technical Data:

 

Brand

Epoxy

equivalent

g/eq

Hydrolysab  le chlorine, wt% ≤

Inorgano- chlorine, wt% ≤

Softening

point

Volatile wt%≤

Color

(Gardner)

 

CYDCN-208

 

200~215

 

0.015

 

0.0005

 

80~95

 

0.15

 

2

CYDCN-200

195~210

0.015

0.0005

60~75

0.1

2


Package and Storage:

  • in 20Kg/PE bag net
  • Store only in the original packing, provide floor trough without outlet, store at 0-30℃, store away from foodstuffs, keep packing tightly sealed

Application /Application Industries:

Due to the multi-epoxy groups existing in the molecules of O-cresol formaldehyde epoxy resin, a large amountoftight cross-bonds areformed after being cured, resulting in excellent thermalstability, mechanical strength, electricity insulation and chemicals resistance. It is mainly used in microelectronic industry. Widely used for the encapsulant of semiconductors and integrated circuits.

More Detail Ortho-Cresol Formaldehyde Epoxy Resin

Product Information

  • Product Name: Ortho-Cresol Formaldehyde Epoxy Resin
  • Chemical Formula: N/A
  • CAS No.: N/A
  • Dangerous Grade: Not regulated as dangerous chemical

Technical Data:

 

Brand

Epoxy

equivalent

g/eq

Hydrolysab  le chlorine, wt% ≤

Inorgano- chlorine, wt% ≤

Softening

point

Volatile wt%≤

Color

(Gardner)

 

CYDCN-208

 

200~215

 

0.015

 

0.0005

 

80~95

 

0.15

 

2

CYDCN-200

195~210

0.015

0.0005

60~75

0.1

2


Package and Storage:

  • in 20Kg/PE bag net
  • Store only in the original packing, provide floor trough without outlet, store at 0-30℃, store away from foodstuffs, keep packing tightly sealed

Application /Application Industries:

Due to the multi-epoxy groups existing in the molecules of O-cresol formaldehyde epoxy resin, a large amountoftight cross-bonds areformed after being cured, resulting in excellent thermalstability, mechanical strength, electricity insulation and chemicals resistance. It is mainly used in microelectronic industry. Widely used for the encapsulant of semiconductors and integrated circuits.

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